CHIPS Act Awards Tracker: Grants, Recipients and Fab Projects
The CHIPS and Science Act, signed in August 2022, set aside $52.7 billion for US semiconductors, including $39 billion in manufacturing incentives run by the Commerce Department’s CHIPS Program Office. Those incentives pay for new fabs, packaging plants and suppliers of wafers, gases and equipment, mostly as direct grants, sometimes with loans. Most of the big awards were finalized in the last months of the Biden administration. The Trump administration kept the programme but changed how it works, most visibly by turning Intel’s grants into a government shareholding. This page lists the major awards, explains what changed in 2025 and 2026, and gives the status of the key fabs as of October 2026.
The Act also carried a “guardrails” clause: recipients can’t materially expand advanced chip capacity in China for ten years. That links the subsidy side of US policy to the export control side covered in the US chip export controls timeline.
Major manufacturing awards
Figures are direct funding as listed by the CHIPS Program Office. “Proposed” means a preliminary award that the programme still lists as not finalized. Loans are noted where they are part of the award.
| Recipient | Direct funding | Sites | Project |
|---|---|---|---|
| Intel | $7.865 billion (converted to equity in Aug 2025) | Chandler, AZ ($3.94B); Hillsboro, OR ($1.86B); New Albany, OH ($1.5B); Rio Rancho, NM ($500M) | Two Intel 18A fabs in Arizona, High-NA EUV development in Oregon, a 14A fab in Ohio, advanced packaging in New Mexico |
| TSMC Arizona | $6.6 billion, plus up to $5 billion in loans | Phoenix, AZ | Three leading-edge fabs (4nm/5nm, 3nm, then 2nm and A16) |
| Micron | $6.44 billion | Boise, ID; Clay, NY; Manassas, VA | Leading-edge DRAM fabs in Idaho and New York; 1-alpha DRAM in Virginia |
| Samsung | $4.745 billion | Taylor and Austin, TX | 2nm logic fabs and R&D in Taylor; FD-SOI expansion in Austin |
| Texas Instruments | $1.61 billion | Sherman, TX ($900M); Lehi, UT ($700M) | 300mm analog and embedded processing fabs |
| GlobalFoundries | $1.45 billion (NY) plus $125 million (VT) | Malta, NY; Burlington, VT | New 300mm fab, silicon photonics packaging, gallium nitride on silicon |
| Wolfspeed | Up to $750 million (proposed) | Siler City, NC; Marcy, NY | Silicon carbide wafers and power devices |
| SK hynix | $458 million | West Lafayette, IN | HBM advanced packaging and R&D |
| Amkor Technology | $407 million | Peoria, AZ | Advanced packaging and test |
| GlobalWafers | $400 million | Sherman, TX ($380M); St. Peters, MO ($20M) | 300mm silicon and silicon-on-insulator wafers |
| Hemlock Semiconductor | $325 million | Hemlock, MI | Semiconductor-grade polysilicon |
| USA Rare Earth | $277 million, plus up to $1.3 billion in loans | Sierra Blanca, TX; Stillwater, OK; Blacksburg, SC | Rare earth mine-to-magnet chain |
| Bosch | $225 million | Roseville, CA | Silicon carbide power chip fab |
| Crucible Metals (Korea Zinc) | $210 million | Clarksville, TN | Smelter for gallium, germanium, antimony and other minerals |
| Microchip Technology | About $162 million (proposed) | Colorado Springs, CO; Gresham, OR | Microcontroller and specialty fab upgrades |
| Polar Semiconductor | $123 million | Bloomington, MN | Sensor and power chip capacity |
| Analog Devices | Up to $105 million | Beaverton, OR; Camas, WA; Chelmsford, MA | Mature-node fab expansion |
| Infinera | Up to $93 million | Bethlehem, PA; San Jose, CA | Optical chip test and packaging |
| Coherent | Up to $79 million (plus up to $50M proposed for Sherman, TX) | Easton, PA | Silicon carbide epitaxial wafers |
| Entegris | $77 million | Colorado Springs, CO | Wafer carriers and filter membranes |
| Absolics (SKC) | $75 million | Covington, GA | Glass substrates for advanced packaging |
| MACOM | Up to $70 million | Durham, NC; Lowell, MA | Gallium nitride and gallium arsenide fabs |
| HP Inc. | $53 million | Corvallis, OR | Expansion of research and manufacturing facility |
| Vulcan Elements | $50 million | Benson, NC | NdFeB rare earth magnets |
| BAE Systems | $35.5 million | Nashua, NH | Defence chip fab modernization (F-35 programmes) |
Smaller awards, some still preliminary, cover Rocket Lab (space solar cells, Albuquerque), Corning (specialty glass, Canton, NY), Edwards Vacuum (vacuum pumps, Genesee County, NY), SkyWater (Bloomington, MN), X-Fab (Lubbock, TX) and Rogue Valley Microdevices (Palm Bay, FL), among others.
Two things stand out in the list. Five companies (Intel, TSMC, Micron, Samsung and TI) account for the large majority of the money. And since 2025 the programme has started funding materials companies as well as chipmakers. USA Rare Earth, Vulcan Elements and Crucible Metals all received awards for minerals and magnets, which ties the CHIPS budget to the problem described in the rare earth magnet supply chain explainer.
What changed under the Trump administration
President Trump criticised the Act in early 2025 and asked Congress to get rid of it. Congress didn’t, and the programme kept running under different management and a different philosophy.
New management. An executive order in March 2025 created the United States Investment Accelerator inside Commerce and put the CHIPS Program Office under it. Commerce Secretary Howard Lutnick said awards would be renegotiated to get “a better deal” for taxpayers.
Bigger pledges, same money. Commerce pushed recipients to raise their investment commitments without larger grants. By Commerce’s January 2026 tally, Micron’s pledge rose from $74.9 billion to $200 billion, TSMC’s from $65 billion to $165 billion, Texas Instruments’ from $29.3 billion to $60 billion and GlobalFoundries’ from $13.4 billion to $16 billion. TSMC then added another $100 billion in July 2026, for a total US commitment of $265 billion and 12 planned fab and packaging facilities, following a US-Taiwan trade and investment deal signed that January.
Equity instead of grants. The largest change came on 22 August 2025, when Intel and the administration agreed to convert grants into stock. The government bought 433.3 million new Intel shares at $20.47 each, $8.9 billion in total, for a 9.9% stake. The money came from $5.7 billion of Intel’s unpaid CHIPS grants and $3.2 billion from the separate Secure Enclave programme for defence chips. Counting $2.2 billion already disbursed, the government’s total investment came to $11.1 billion. The stake is passive (no board seat, and the government agreed to vote with the board in most cases), and the deal removed the clawback and profit-sharing terms of the original grant. The government also got a five-year warrant for another 5% at $20 a share, usable only if Intel’s ownership of its foundry business falls below 51%. In January 2026 Commerce said its restructured awards had produced about $20 billion of potential upside for taxpayers.
The same equity approach has spread. Commerce proposed a $150 million equity stake in xLight, a lithography light-source startup, and in May 2026 announced about $2 billion for nine quantum computing companies, again taking equity. Outside the CHIPS budget, the Pentagon took a stake in rare earth producer MP Materials in July 2025.
R&D cut back. In August 2025 Lutnick moved to cut off Natcast, the nonprofit set up to run the National Semiconductor Technology Center, calling it a vehicle for “Biden-era cronyism,” and $7.4 billion in planned funding was withheld. Several CHIPS R&D bodies, including the industrial advisory committee and the advanced packaging programme’s steering groups, have been inactive since.
A bigger tax credit. The 2025 budget law raised the advanced manufacturing investment tax credit from 25% to 35% for qualifying fab projects, a benefit worth more to most chipmakers over time than the grants themselves.
Status of the key fabs as of October 2026
TSMC, Phoenix. The first fab has been in volume production on 4nm-class processes since early 2025. TSMC said in January 2026 that its second fab would begin volume production of 3nm chips in the second half of 2027. The third fab, for 2nm and A16, is under construction. What those node names mean is explained in chip node names decoded.
Intel, Arizona and Ohio. Fab 52 in Chandler makes Intel 18A chips, including Core Ultra Series 3 processors, and the improved 18A-P process entered risk production by mid-2026. Ohio is far behind its original 2025 target: Intel said in early 2025 that the first New Albany fab would not be finished until about 2030, with operations starting 2030 to 2031. Intel’s finances have changed a lot since the equity deal. Nvidia invested $5 billion in September 2025, SoftBank bought shares at $23, and in August 2026 Intel sold $20 billion of new stock at $95 a share.
Samsung, Taylor. The award covers two 2nm logic fabs and an R&D centre, with all facilities expected to be running by 2030 under the award terms. Samsung’s biggest customer win for the site is a $16.5 billion contract signed with Tesla in July 2025 to make Tesla’s AI6 chips there.
Micron, Idaho and New York. Boise comes first, with two high-volume DRAM fabs. The four-fab Clay megafab in New York is the long-horizon part of the plan; the award describes up to $150 billion of capital spending across Micron’s sites over about two decades.
Wolfspeed, North Carolina. The silicon carbide maker filed for Chapter 11 on 30 June 2025 and emerged in September 2025 after cutting about $4.6 billion of debt. Its $750 million award is still listed as proposed.
Texas Instruments and GlobalFoundries. Both run mature-node and specialty fabs rather than leading-edge logic. Their awards were finalized in late 2024, and both raised their US investment pledges in 2025.
What to watch
The Intel model is the template to watch. If Commerce keeps converting grants into shares, the CHIPS programme will look less like a subsidy fund and more like a government investment portfolio, with all the questions about conflicts and influence that brings. The other tests are physical. TSMC’s 3nm fab in 2027 and Samsung’s ramp in Taylor will show whether the US can run leading-edge production at scale, and Intel’s Ohio timeline will show whether the $1.5 billion set aside there produces a fab this decade.
For how subsidies, export controls and tariffs fit together, see the complete timeline of US-China technology decoupling. For the enforcement side of chip policy, see how restricted GPUs reach China.